Info
Info
News Article

EU Project To Combine InP Quantum Dots And SiN

News
MOICANA collaboration is bringing together four industrial partners and four academic and research institutes in the PIC and photonic systems value chain

The wide-spread adoption of optical transceivers in a broad range of applications is urgently calling for a low-cost, high power efficient and large volume manufacturing integration technology that can meet the different specifications required in every application sector.

Current solutions favour silicon photonics based technologies that still feature a major drawback: namely they need complex and expensive hybrid integration substrates, since they rely on externally coupled InP laser sources for the final assembly. Meanwhile, the testing for the pre- and post- processed coupled laser adds further costs.

MOICANA is a new ambitious EU H2020 R&D Project which was launched early in 2018. It aims to develop fundamental innovations in the field of photonic integrated transmitters, making them cheaper and more power efficient.

The consortium is bringing together four industrial partners, and four academic and research institutes in the PIC and Photonic Systems value chain. The project participants are the Aristotle University of Thessaloniki (Greece), University of Kassel (Germany), Technion- Technical University of Israel (Israel), III-V lab (France), Mellanox Technologies (Israel), Ligentec (Switzerland), ADVA (Germany) and VLC Photonics (Spain).
MOICANA is funded under the H2020 ICT 2016-2017 "“ Photonics KET Call and the initiative of the Photonics Public Private Partnership. The project is coordinated by Aristotle University of Thessaloniki in Greece and will be running through to December 2020.

MOICANA aims to demonstrate breakthrough performance by combining Quantum Dot InP structures as the III-V light source material and SiN from the silicon photonics for the passive platform. The ideas is to minimise the cost of high volume fabrication of optical transmitters through the development of technology for epitaxy of the QD InP components directly on Si by selective area growth.

The project partners aim to the demonstrations of a whole new series of cooler-less, energy-efficient and high-performance single-channel and WDM transmitter modules for data centre interconnects, for 5G Mobile fronthaul and for coherent communication applications.

PIC International 31st March – 1st April 2020.

JOIN THE MARKET LEADING GLOBAL INTEGRATED PHOTONICS CONFERENCE AND EXHIBITION TODAY!

In its fifth year, PIC International has become the definitive global integrated photonics conference, providing comprehensive coverage of the industry.

The tenth edition taking place in Brussels will be no exception and is set to be even bigger and better! Co-located with CS International and SSI International, PIC International is part of AngelTech, which delivers a portfolio of insightful, informative, highly valued chip-level conferences.

Bringing together 3 conferences, 800+ delegates, 80+ exhibitors, 120+ presentations and numerous networking opportunities, AngelTech is the number one global event covering compound semiconductor, photonic integrated circuit and sensor technologies. With a strong over-lap between the three conferences, attendees and exhibitors are exposed to the full relevant supply chains and customer and supplier bases.

ACT NOW – LESS THAN 85 TICKETS REMAINING

View Agenda    Register your place here

Info
×
Search the news archive

To close this popup you can press escape or click the close icon.
Logo
×
Logo
×
Register - Step 1

You may choose to subscribe to the PIC Magazine, the PIC Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in:
 
X
Info
X
Info
{taasPodcastNotification}