+44 (0)24 7671 8970
More publications     •     Advertise with us     •     Contact us
 
Loading...
News Article

Oclaro and Acacia collaborate on 100/200G CFP2-DCO products

News

Acacia Communications, a provider of high-speed coherent optical interconnect products, and Oclaro, a provider and innovator of optical communications solutions, has announced that they are enabling a multi-vendor environment of fully interoperable CFP2-DCO modules based on Acacia's Meru DSP. Oclaro plans to launch a new CFP2-DCO module that will feature plug-and-play compatibility with the Acacia CFP2-DCO, providing customers with two proven coherent optics suppliers for the 100/200G CFP2-DCO form factor.

CFP2-DCOs are becoming increasingly important for higher-speed optical networks because they integrate the coherent DSP into the pluggable module. The digital host interface enables simpler integration between module and system resulting in faster service activation and a pay-as-you-grow deployment model for telecommunication providers whereby the cost of additional ports can be deferred until additional services are needed.

The CFP2-DCO pluggable coherent modules from Oclaro and Acacia support transmission speeds of 100G and 200G for use in access, metro and data center interconnect markets. This form factor is being introduced by multiple network equipment manufacturers (NEMs) in switch, router, and transport platforms. The CFP2-DCO modules support four times higher density than current generation 100G CFP-DCO solutions by doubling the data rate in a smaller, lower power, pluggable module enabling customers to quickly and cost-effectively roll-out 200G networks. In addition to proprietary operating modes, both companies intend to support the requirements of the Open ROADM MSA for interoperability at 100G.

"Network operators and our system partners are excited about the ramp of our CFP2-DCO module," said Benny Mikkelsen, Chief Technology Officer of Acacia Communications. "By partnering with Oclaro to ensure interoperability with their Meru-based CFP2-DCO module, we believe we will be better positioned to address the DCO market as industry trends shift favorably toward the CFP2 form factor. We are excited about our relationship with Oclaro and believe that broader adoption of 200G CFP2-DCO modules will be mutually beneficial to our two companies and the customers we serve."

"Our 43Gbaud Coherent Transmitter Receiver Optical Sub-Assembly (TROSA) is at the heart of our CFP2-DCO. The TROSA leverages proven Indium Phosphide PIC technology from Oclaro's highly successful CFP2-ACO to achieve industry leading optical performance in a small form factor," said Beck Mason President of the Integrated Photonics Business at Oclaro. "By establishing a fully interoperable solution with Acacia, our customers will have two sources of supply for these critical components, enabling them to efficiently upgrade their networks to higher speeds."

EMCORE announces integration of PICs into its products
Scottish photonics consortium wins £4.7m in UKRI funding
Yuanjie Semiconductor to supply lasers to POET
Fraunhofer IPMS announces government funding for quantum photonic chip
POET Technologies partners with Yuanjie Semiconductor Technology
SiLC announces silicon photonics systems for machine vision
Scientists develop novel optical modulators for integrated photonics
Scientists report integrated photodiodes on TFLN
Coherent wins award for innovative photonics product
FBH to present quantum technology developments at EQTC 2023
Skorpios and FormericaOE demonstrate PICs in 800G optical transceivers
EFFECT Photonics verifies fully integrated InP PIC
NASA awards grant for silicon photonics project
OpenLight and Spark Photonics partner on PIC design services
DustPhotonics announces 800G chip for hyperscale data centres and AI
Lightwave Logic Receives Industry Innovation Award
Imec announces SiGe BiCMOS optical receiver
SiFotonics announces silicon photonics 800G LPO solutions
Rockley Photonics progresses noninvasive biomarker monitoring
MantiSpectra secures €4 million for miniaturised spectrometers
Sivers to demo next-gen laser arrays at ECOC 2023
ASMPT AMICRA and Teramount collaborate on silicon photonics packaging
Quantum Computing Inc. selects Arizona site for photonic chip foundry
German government to fund ams OSRAM optoelectronic semiconductor development
Luceda Photonics introduces new PIC design software
Vodafone explores silicon photonics for future mobile networks
Coherent introduces 1200 mW pump laser module
Photonics startups invited to apply to Luminate NY accelerator
New tool could improve lithography for smaller, faster chips
InP-based lasers surpass 2.2 mm
Indie Semiconductor buys Exalos AG
New technique controls direction and wavelength of emitted heat

×
Search the news archive

To close this popup you can press escape or click the close icon.
Logo
×
Logo
×
Register - Step 1

You may choose to subscribe to the PIC Magazine, the PIC Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in: