+44 (0)24 7671 8970
More publications     •     Advertise with us     •     Contact us
 
Loading...
News Article

Rostelecom to Upgrade TEA Cable System

News

Rostelecom PJSC has announced that it plans to begin a significant upgrade of the transcontinental Transit Europe-Asia (TEA) cable system this year. The upgrade will increase the capacity of TEA, which connects Europe with China and Japan, to 2 Tbps, with individual channels offering 100 Gbps.

The upgrade is part of a TEA modernization program Rostelecom inaugurated in 2016. The upgrades already deployed as part of that effort have led to (USD) $30 million in new customer contracts, according to the Russian service provider.

"Further development of our TEA project is one of the key goals of Rostelecom wholesale business," explained Natalia Kryuchkova, vice president for carrier business at the service provider. "With some of the largest operators in European and Asian regions as major customers, Rostelecom expects significant sales growth thanks to new network capabilities, and through engagement with new partners for traffic transmission."

The TEA project began in February 2003 with the signing of the strategic Telecommunications Services Agreement between Russia and China. Rostelecom says it plans to further upgrade the fiber-optic network's capacity to 10 Tbps within the next several years.

EMCORE announces integration of PICs into its products
Scottish photonics consortium wins £4.7m in UKRI funding
Yuanjie Semiconductor to supply lasers to POET
Fraunhofer IPMS announces government funding for quantum photonic chip
POET Technologies partners with Yuanjie Semiconductor Technology
SiLC announces silicon photonics systems for machine vision
Scientists develop novel optical modulators for integrated photonics
Scientists report integrated photodiodes on TFLN
Coherent wins award for innovative photonics product
FBH to present quantum technology developments at EQTC 2023
Skorpios and FormericaOE demonstrate PICs in 800G optical transceivers
EFFECT Photonics verifies fully integrated InP PIC
NASA awards grant for silicon photonics project
OpenLight and Spark Photonics partner on PIC design services
DustPhotonics announces 800G chip for hyperscale data centres and AI
Lightwave Logic Receives Industry Innovation Award
Imec announces SiGe BiCMOS optical receiver
SiFotonics announces silicon photonics 800G LPO solutions
Rockley Photonics progresses noninvasive biomarker monitoring
MantiSpectra secures €4 million for miniaturised spectrometers
Sivers to demo next-gen laser arrays at ECOC 2023
ASMPT AMICRA and Teramount collaborate on silicon photonics packaging
Quantum Computing Inc. selects Arizona site for photonic chip foundry
German government to fund ams OSRAM optoelectronic semiconductor development
Luceda Photonics introduces new PIC design software
Vodafone explores silicon photonics for future mobile networks
Coherent introduces 1200 mW pump laser module
Photonics startups invited to apply to Luminate NY accelerator
New tool could improve lithography for smaller, faster chips
InP-based lasers surpass 2.2 mm
Indie Semiconductor buys Exalos AG
New technique controls direction and wavelength of emitted heat

×
Search the news archive

To close this popup you can press escape or click the close icon.
Logo
×
Logo
×
Register - Step 1

You may choose to subscribe to the PIC Magazine, the PIC Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in: