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PIXAPP announces training programme in advanced photonic packaging

Thursday 8th March 2018

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PIXAPP the European Photonic Packaging Pilot Line announces the opening of its new hands-on training programme in advanced photonic packaging. The first training course was held at Tyndall National Institute, University College Cork in January, with participants from around the world attending the week-long course.



European Photonic Packaging Pilot Line course covers optical, electrical, thermal and mechanical aspects of packaging technologies


The PIXAPP training programme aims to provide industry, and those involved in photonic product development, with fundamental technical skills in package design, assembly and reliability testing and covers the key optical, electrical, thermal and mechanical aspects of packaging technologies. It also provides an overview of packaging equipment and photonic device foundry services, regarded as critical parts of the packaging ecosystem.

About the PIXAPP Pilot Line

PIXAPP is funded by the European Commission and was established in January 2017. The goal of PIXAPP is to support the transition of integrated photonic devices from prototypes to manufacture via pilot-scale production. PIXAPP is a distributed consortium of partners with a wide range of packaging technologies and capabilities, from the development of advanced photonic prototypes through to medium-volume commercial production. A key focus of PIXAPP is to establish a set of packaging design standards and related design rules which provides users with accessible. well-defined and qualified packaging technologies that are sufficiently flexible to address a wide range of markets, from communications to sensing and medical diagnostics. PIXAPP also provides advanced training to industry, including practical hands-on laboratory-based training using state-of-the-art equipment and training on advanced PIC design, test and reliability systems.


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