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Oclaro Announces 100G PAM4 Lasers

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Electro-absorption modulated lasers meet growing demand for 400G high-speed interconnects

Oclaro has announced general availability of its 100G PAM4 EA-DFB EML (electro-absorption modulated laser) chips for next-generation transceiver applications.

The EML chips operate at 53 Gbaud with up to 40GHz bandwidth (at 20degC) and 6dB extinction ratio (at70degC). They are suited for use in pulse amplitude modulation-based (PAM4) transceivers, enabling 100 Gbps per wavelength.

Combining high-performance and low power consumption, Oclaro says its EML chips pave the way for the next wave of 200 Gbps and 400 Gbps in data centre networks.

Oclaro also announced additional wafer fab capacity upgrades for Directly Modulated Lasers (DML) and EML laser production, providing greater availability for its world-class components. This newly installed production capacity will enable Oclaro to satisfy the increasing demand for cost-effective high-speed transceivers.

"Oclaro's proven laser technology has been the benchmark for high-performance and reliability, and is ideally suited to support the PAM4 modulation formats used to deliver higher-speed networks affordably," said Yves LeMaitre, chief strategy officer of Oclaro. "With the explosive growth of large scale data centres, the demand for these lasers has never been greater and by increasing our manufacturing capacity, Oclaro can ensure its customers have the supply they need to be successful."

Oclaro's high-speed 25G DML chips are well suited for 100 Gbps CWDM4 transceivers and have been produced in high volume for the last two years.

They can also be used in low-cost SFP28 modules and other 25 Gbps products for high-volume, low-cost applications. Oclaro's EML devices provide the high bandwidth and linearity needed for next-generation 200 Gbps and 400 Gbps transceivers using PAM4, while still maintaining small size and low cost.

Oclaro's laser chips support both CWDM4 and LAN-WDM wavelength standards, and in many applications, uncooled operation and non-hermetic packaging can be employed for low-cost, high performance module solutions, including PAM4 transceivers for higher data rates.



PIC International 26-27 March 2019, Sheraton Airport Hotel, Brussels

Sales of PICs are soaring, with their deployment helping to boost the capacity of networks and data centres. To aid this industry, we help strengthen the relationships between the makers and the users of these integrated circuits by organising the 4th PIC International, a global conference dedicated to this industry.

Attendees to the conference will hear from industry-leading insiders delivering more than 30 presentations spanning five sectors. The conference will equip delegates with an up-to-date overview of the status of the PIC industry, and provide them with many opportunities to meet other key players within the community.

Places will be limited, so register your place today: https://picinternational.net

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