Loading...
News Article

CST Global appoints new principal Device Development engineer

News

Susannah Heck brings a wealth of technical experience in opto-electronic integration, device and process design to UK III-V fab

CST Global - a UK-based III-V foundry - has appointed Susannah Heck as principal device development engineer.

Heck was previously principal engineer at Kaiam in Livingston, West Lothian, and senior research and development engineer at Oclaro, Northamptonshire. She has been both programme manager and technical lead on projects including next-generation, 100G, data centre, opto-electronic hardware design, development and verification.

Andrew McKee, technical director at CST Global, commented: "Susannah brings a wealth of technical experience in monolithic and hybrid opto-electronic integration; active and passive device design and verification on III-V compound semiconductors; and epitaxy, lithographic-mask and process design for wafer production. She also brings invaluable project planning, budgeting, resource allocation and management expertise, with exceptional communication skills."

Susannah began her working career as a research intern at the Tyndall National Institute, University College Cork before becoming a research associate in the Experimental Solid-State Physics department, at Imperial College London.

Susannah has a BSc Hons and PhD in Physics, from University College Cork, specialising in characterisation of quantum dot and dash devices; material properties related to quantum dot anisotropy; and threshold current and efficiency of III-V semiconductor lasers.

She is the author and co-author of a number of respected journals and conference papers in the photonics field.

Lightwave Logic receives ECOC Innovation Award for Hybrid PIC/Optical Integration Platform
Coherent wins ECOC award for datacentre innovation
HyperLight announces $37 million funding round
Jabil expands silicon photonics capabilities
Ephos raises $8.5 million for glass-based photonic chips
Designing for manufacture: PAM-4 transmitters using segmented-electrode Mach-Zehnder modulators
OpenLight and Epiphany partner on PIC ecosystem
NewPhotonics and SoftBank team up on advanced photonics
POET and Mitsubishi collaborate on 3.2T optical engines
Integrated photonic platforms: The case for SiC
Integrating high-speed germanium modulators with silicon photonics and fast electronics
Lightium Secures $7 Million Seed Funding
Revolutionising optoelectronics with high-precision bonding
Fraunhofer IMS invites participation in PIC engineering runs
Advances in active alignment engines for efficient photonics device test and assembly
Aeva announces participation at IAA Transportation 2024
Sumitomo Electric announces participation in ECOC 2024
Quside receives NIST certification for quantum entropy source
DustPhotonics launches industry-first merchant 1.6T silicon photonics engine
Arelion and Ciena announce live 1.6T wave data transmission
DGIST leads joint original semiconductor research with the EU
POET Technologies reorganises engineering team
A silicon chip for 6G communications
South Dakota Mines wins $5 million from NSF for Quantum Materials Institute
HieFo indium phosphide fab resumes production
Coherent launches new lasers for silicon photonics transceivers
AlixLabs wins funding from PhotonHub Europe
Sandia National Labs and Arizona State University join forces
Perovskite waveguides for nonlinear photonics
A graphene-based infrared emitter
Atom interferometry performed with silicon photonics
A step towards combining the conventional and quantum internet

×
Search the news archive

To close this popup you can press escape or click the close icon.
Logo
x
Logo
×
Register - Step 1

You may choose to subscribe to the PIC Magazine, the PIC Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in: