Info
Info
Info

ColorChip To Demo 100G Transceivers At SuperComputing 2017

News

ColorChip and Caltech to show next generation SDN platform based on 100G QSFP28 2km CWDM4 and 10km 4WDM data centre transceivers

ColorChip, a maker of hyper-scale single mode fibre optical transceivers for data centres and HPCs applications, will take part in a demonstration of a next generation SDN platform using intelligent software defined networks. ColorChip's 100G QSFP28 2km CWDM4 and 10km 4WDM transceivers, used in data centre Interconnect links, will be demonstrated in Caltech's booth on November 13th-17th during SuperComputing 2017 Exhibition in Denver, Colorado, USA.

100G QSFP28 Transceivers for applications from 100m to 10km

The exhibition of the Next Generation SDN architecture will employ a family of ColorChip 100G QSFP28 Transceivers, all based on ColorChip's patented SystemOnGlass (SOG) TOSA/ROSA platform, including the 100G QSFP28 2km CWDM4 and 10km 4WDM-10 transceivers . The 100G transceivers are based on uncooled DML's on the CWDM grid and characterised by typical power consumption of 2.6W, highly compact QSFP28 packaging and a standard Duplex LC optical interconnect. The ColorChip family of 100G QSFP28 transceivers also includes a 500m CWDM-Lite data centre transceiver, accepted by the Open Compute Project (OCP).

High Volume 100G Manufacturing

In response to the rapidly expanding 100G data centre and HPC market demand, ColorChip has invested $80M, secured over the past two years, to significantly increase the manufacturing throughput of its family of 100G QSFP28 transceivers, including the expansion of its industrialised-optics TOSA/ROSA assembly lines in the Israel based facility as well as doubling the optical module integration and testing floor space to 7,000 square feet in Contract Manufacturer Fabrinet. With a current annual production run rate of quarter of a million transceivers in 2017, the ColorChip family of 100G 500m, 2km and 10km QSFP28 transceivers is ready for volume applications today.

Demonstration at SuperComputing 2017

The next generation of globally distributed science programs, exploring the nature and history of the universe, the evolution of our planet and our biological makeup, face unprecedented challenges in harnessing the wealth of knowledge hidden in exabytes of globally distributed data. The physicists, network and system engineers from Caltech, together with ColorChip and many other research and network partners are working to clear the way to the next round of discoveries by leveraging major advances in software defined Terabit/second networks, real-time analytics and state of the art long distance data transfer methods.

The Caltech and Starlight/OCC booths will be linked through a pair of eata centre Interconnects at a rate of 1 terabit/second and out over the wide area to multiple remote sites through additional DCIs installed at the booths, supporting 200G and 400G wavelengths, with an aggregate capacity of several terabits/second. The demonstrations at these booths will be supported by multiple flows of up to 100G wire speed over many 100G wide area links to partner sites cited above, in the US as well as in Latin America and Asia, involved in the LHC, LSST and other data intensive science programs.

Harvey Newman, professor of Physics at Caltech, a leader of the SC17 Network Research Exhibition demonstrations at the Caltech booth said, "ColorChip continues to be a key partner making our breakthrough developments in state of the art networks supporting the largest science research programs possible, through the use of their intermediate-range optical transceivers carrying 100 Gbps flows over dark fibre links among the Caltech, UNESP, SDSC and 2CRSI booths across the showfloor, extending out over the wide area to many sites in the US and Latin America."


Info
Your First Name
Your Email Address
Next »Close
 
×
Search the news archive

To close this popup you can press escape or click the close icon.
Logo
×
Logo
×
Register - Step 1

You may choose to subscribe to the PIC Magazine, the PIC Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in:
 
X
Info
X
Info