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Lightwave Logic CEO To Speak At PIC Event In California

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Michael Lebby to talk about potential of polymer based PICs to scale to 400Gbps and 800Gbps data centre applications

Lightwave Logic, a technology company focused on the development of photonics devices and non-linear optical polymer materials systems for data communications, will address participants at ‘PIC Training Silicon Valley 2017’ on November 13-15, 2017 in Santa Clara, California.

The PIC (Photonics Integrated Circuit) industry is an annual event that provides PIC training and is intended for engineers and scientists that want to further their photonic integration skills, both technically, and from a business perspective. PIC Training Silicon Valley 2017 has support from over 25 companies that range from design/layout software, MPW (multi-project wafer) foundries, packaging, test & measurements, design houses, etc.

Lightwave Logic’s CEO, Michael Lebby has been invited to provide industry perspectives for its P2IC TM polymer PIC platform which includes the company’s extensive strategic marketing experience that applies to its outlook as to how PIC based technologies will grow and enable huge opportunities over the next decade. . Lebby will show how polymer based PICs have the potential to scale to 400Gbps and 800Gbps data centre applications.

Lebby noted, “Being invited to one of the most important industry PIC training events in the world is significant for Lightwave Logic as it demonstrates that the technical community is interested to hear more about our polymer P2IC TM platform for high speed fibre communications.

“Our progress with Mach Zehnder modulators over the past 12 months has brought us to the point where we are confident that our polymer technology platform is scalable in that it offers a pathway to increasing performance while simultaneously decreasing cost. Earlier this year we achieved 50Gbps operation, and at this event we intend to show the broader PIC community that the platform is robust and we are finalising actual demonstration devices that will be a stepping stone to the explosive demand for 400 Gbps modulator solutions."


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