+44 (0)24 7671 8970
More publications     •     Advertise with us     •     Contact us
 
Loading...
News Article

Swiss insurance firm Chooses Ciena to connect data hubs

News

System will allow Helvetia to transport data at 200 Gb/s across distances up to 130km without amplifiers

Swiss insurance firm Helvetia has selected Ciena for a data centre interconnect (DCI) network between its major data hubs in Switzerland.

Helvetia will use a suite of Ciena solutions as part of this network build, including Waveserver and the 6500 Packet-Optical Platform, for high-capacity Ethernet and Fibre Channel interconnect.

This deployment will also enhance the security of Helvetia's network using Ciena's integrated WaveLogic Encryption, ensuring data is always protected as it travels between Helvetia's Swiss data centres.

Helvetia Switzerland (part of the Helvetia Group) is one of Switzerland's large insurance providers, with more than 1.3 million customers nationally. Recent corporate acquisitions and market growth is driving Helvetia to increase its data centre footprint within Switzerland and improve existing links between key business hubs. With Ciena, Helvetia is significantly increasing the scalability, reliability and capacity of its network links between the Swiss Data centre locations.

With this simple high-capacity network, Helvetia will be able to transport data at 200 Gb/s across distances up to 130km without requiring costly Raman amplification or intermediate amplifier sites.

This deployment also includes 200G wire-speed encryption for enhanced data transmission security, along with Ciena's software-based MyCryptoTool, a dedicated management user portal that provides full control of all security parameters associated with protecting data traveling across the network. This allows Helvetia's security team to manage the encryption capabilities, while the network team separately manages network operations.

Kapsch CarrierCom, a global system integrator and supplier of end-to-end telecommunications solutions and a Ciena BizConnect partner, is deploying Helvetia's robust Ciena-based network as a fully managed service.

"As the financial services sector moves to provide more online offerings there is a growing need for highly-reliable and continuous connectivity. By bolstering our DCI networks with Ciena, Helvetia ensures we can securely deliver the applications and services needed for our employees to be successful at their jobs and our customers to have access to critical information "“ whenever they need it," said Andreas Hagin, lead engineer, IT Infrastructure, Helvetia

"Today's data centres don't exist in isolation but rather need to share data and content with each other and provide back-up and redundancy. Helvetia sees these challenges as opportunity, and by using Ciena's solutions for its in-house data needs the company is well-placed to be a leader in the digitisation of the insurance market," said Daniel Prokop, regional sales director, Central Europe, Ciena

EMCORE announces integration of PICs into its products
Scottish photonics consortium wins £4.7m in UKRI funding
Yuanjie Semiconductor to supply lasers to POET
Fraunhofer IPMS announces government funding for quantum photonic chip
POET Technologies partners with Yuanjie Semiconductor Technology
SiLC announces silicon photonics systems for machine vision
Scientists develop novel optical modulators for integrated photonics
Scientists report integrated photodiodes on TFLN
Coherent wins award for innovative photonics product
FBH to present quantum technology developments at EQTC 2023
Skorpios and FormericaOE demonstrate PICs in 800G optical transceivers
EFFECT Photonics verifies fully integrated InP PIC
NASA awards grant for silicon photonics project
OpenLight and Spark Photonics partner on PIC design services
DustPhotonics announces 800G chip for hyperscale data centres and AI
Lightwave Logic Receives Industry Innovation Award
Imec announces SiGe BiCMOS optical receiver
SiFotonics announces silicon photonics 800G LPO solutions
Rockley Photonics progresses noninvasive biomarker monitoring
MantiSpectra secures €4 million for miniaturised spectrometers
Sivers to demo next-gen laser arrays at ECOC 2023
ASMPT AMICRA and Teramount collaborate on silicon photonics packaging
Quantum Computing Inc. selects Arizona site for photonic chip foundry
German government to fund ams OSRAM optoelectronic semiconductor development
Luceda Photonics introduces new PIC design software
Vodafone explores silicon photonics for future mobile networks
Coherent introduces 1200 mW pump laser module
Photonics startups invited to apply to Luminate NY accelerator
New tool could improve lithography for smaller, faster chips
InP-based lasers surpass 2.2 mm
Indie Semiconductor buys Exalos AG
New technique controls direction and wavelength of emitted heat

×
Search the news archive

To close this popup you can press escape or click the close icon.
Logo
×
Logo
×
Register - Step 1

You may choose to subscribe to the PIC Magazine, the PIC Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in: