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Looking Ahead To PIC International 2018

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Attendees have even more to look forward to at PIC International 2018 in Brussels (April 10-11) including on-stage industry panels, new additions to the awards programme and a fresh perspective on global opportunities for optical chips. James Tyrrell updates on the agenda for next year's must-attend event.

Since making its debut on the conference calendar in 2016, PIC International has grown from strength to strength, attracting innovators such as Facebook, Cisco, Intel, IBM, Microsoft, and many others, for a two-day focus on upcoming opportunities for integrated photonics. Talking points include telecoms and data centre upgrades, new and emerging market segments in biotechnology, environmental sensing and automotive, as well as other exciting prospects for optical chips. The discussion covers all aspects of PIC production including materials platforms, design tools, fabrication equipment and options for test & measurement, as well as market analysis and customer perspectives.



Updated each year to capture the latest industry trends, the conference programme welcomes new speakers and "“ new for 2018 "“ includes on-stage industry panels examining high-volume opportunities for PICs, and discussing progress in silicon photonics.

Five key themes
Moving the data: PICs for cloud computing and telecoms - Data centres and networks need smart solutions to manage the sharp growth in traffic. What can integrated photonics bring to the table and how can developers make sure their products appeal to key customers?

Refining the PIC: achieving the next milestone in performance - What are the leading approaches for integrating key building blocks at the chip-level and how can we bring together electronics and photonics more efficiently?

Delivering the goods: advances in PIC manufacturing - What are the latest tools and techniques that can be deployed in the fab? And what are the options when it comes to evaluating the output?

PIC Design, simulation and packaging: a blueprint for future success - How can we implement ideas faster and what needs to be considered to keep the final device cost on track?

PIC horizons: new and emerging applications for integrated photonics - How can developers capitalize on opportunities for optical platforms in growth areas such as medical diagnostics, industrial sensing and biological analysis?

Recognizing leading lights in the industry
The PIC awards were a big hit at the 2017 show (see "“ "˜PIC Awards in pictures', issue #5) and with two new awards for 2018 there are even more opportunities to join in the celebration. You'll find full details at www.picawards.net/categories and nominations are open until 17 November 2017.


Book your tickets now

All of the speaker details can be found on the conference website, including instructions on how to book delegate tickets and find out more about exhibit opportunities. Both 2016 and 2017 shows were extremely popular with attendees and so we advise registering your interest early.



AngelTech Live III: Join us on 12 April 2021!

AngelTech Live III will be broadcast on 12 April 2021, 10am BST, rebroadcast on 14 April (10am CTT) and 16 April (10am PST) and will feature online versions of the market-leading physical events: CS International and PIC International PLUS a brand new Silicon Semiconductor International Track!

Thanks to the great diversity of the semiconductor industry, we are always chasing new markets and developing a range of exciting technologies.

2021 is no different. Over the last few months interest in deep-UV LEDs has rocketed, due to its capability to disinfect and sanitise areas and combat Covid-19. We shall consider a roadmap for this device, along with technologies for boosting its output.

We shall also look at microLEDs, a display with many wonderful attributes, identifying processes for handling the mass transfer of tiny emitters that hold the key to commercialisation of this technology.

We shall also discuss electrification of transportation, underpinned by wide bandgap power electronics and supported by blue lasers that are ideal for processing copper.

Additional areas we will cover include the development of GaN ICs, to improve the reach of power electronics; the great strides that have been made with gallium oxide; and a look at new materials, such as cubic GaN and AlScN.

Having attracted 1500 delegates over the last 2 online summits, the 3rd event promises to be even bigger and better – with 3 interactive sessions over 1 day and will once again prove to be a key event across the semiconductor and photonic integrated circuits calendar.

So make sure you sign up today and discover the latest cutting edge developments across the compound semiconductor and integrated photonics value chain.

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