Cutting packaging costs with compression molding
Towa Europe's managing director Huub Claassen to speak at Photonic Integration Conference in Eindhoven
Huub Claassen, managing director of Towa Europe BV, a supplier of chip packaging equipment, will talk about 'Large scale optical and electrical packaging of photonic devices by using transfer and/or compression molding technology. A possibility to reduce cost', at the 3rd edition of the Photonic Integration Conference, on September 26, 2017, at High Tech Campus Eindhoven, The Netherlands.
The traditional technology for chip encapsulation is transfer molding. However, transfer molding has not been suitable for packaging wafer level devices, very thin BGA and large area size MAP substrates,
Towa Japan has developed a compression molding method that can perform resin flow-free molding by using a granular or liquid type of molding compound.
In this presentation, Claassen will explain molding methods in some detail, and how the packaging of photonic devices with these methods should be possible and should also cut costs.
Other speakers at the upcoming conference include AIM Photonics, PhotonDelta, BRIDG "“ Bridging the Innovation Development Gap, Tyndall National Institute, University of Glasgow, Fibre To The Home COUNCIL EUROPE, Lightwave Logic, LioniX International and CEA-LETIt.
The conference program also includes a session on 'Semicon meets Photonics', hosted by The Business Cluster Semiconductors Netherlands, where you can catch a glimpse into the important role that photonics is expected to play in the future of the semiconductor industry.
