Loading...
News Article

AIM Photonics and NY-Power Electronics Manufacturing Consortium highlight collaboration at SEMICON West 2017

News

Prominent New York State Tech Pavilion and Nanotech Summit at SEMICON West Exhibition to showcase innovation-based business growth opportunities

SUNY Polytechnic Institute (SUNY Poly), in partnership with Empire State Development (ESD), the American Institute for Manufacturing Integrated Photonics (AIM Photonics), and the New York Power Electronics Manufacturing Consortium (NY-PEMC) have announced that a number of the institution's leading researchers and scientists from a number of SUNY Poly's corporate partners, as well as New York State economic development experts will share research and development updates at the SEMICON West 2017 conference, taking place on 11 - 13 July in San Francisco, California.

During this year's engagement, researchers based at SUNY Poly's Albany campus will present progress reports for a number of initiatives it is spearheading across New York State, including updates on AIM Photonics and the NY-PEMC, which are ramping up capabilities related to the development of next-generation photonics-based technologies, quantum computing, and silicon carbide-based power electronics respectively, in addition to spurring economic engagement activities throughout New York State.

"Empire State Development is proud to once again collaborate with our partners at SUNY Poly and Upstate New York's economic development organizations to showcase New York State's high-tech research, development and business growth opportunities at SEMICON West," said Empire State Development President, CEO & Commissioner Howard Zemsky. "Our strategic approach and improved business climate are successfully attracting innovative firms and entrepreneurs, and we're looking forward to sharing our story with attendees and business leaders from around the world, particularly those who can benefit from the cutting-edge work being done in power electronics and photonics."

"As a leading member of the AIM Photonics and NY-PEMC initiatives that are driving R&D in key areas, SUNY Poly is proud to work with Empire State Development at SEMICON West 2017 to share current progress with industry leaders who will be attending this year's conference and exhibition," said SUNY Poly Interim President Dr. Bahgat Sammakia. "By partnering with world-leading corporations, institutions, and organizations in the high-tech arena to share how further collaboration can help drive innovation and growth in New York State, SUNY Poly is thrilled once again to play a significant role at SEMICON West."

At this year's SEMICON West conference, SUNY Poly Vice President for Research and CEO of AIM Photonics Dr. Michael Liehr, SUNY Poly Associate Vice President for Business, Wafer Processing and CMO of AIM Photonics Frank Tolic will provide updates on the initiative as it begins building and equipping the Rochester-based photonics Test, Assembly, and Packaging (TAP) facility. More specifically, AIM Photonics and SUNY Poly leaders will provide presentations on topics including: "The integrated silicon photonics 21st century revolution," and "Leveraging state-of-the-art fabrication to advance quantum computing technologies," among others. In addition, presentations will also detail AIM Academy and workforce development efforts designed to ensure AIM Photonics-related positions will be filled from a pool of diverse, highly qualified candidates.

"As the national AIM Photonics initiative hits its stride, initializing important research and development work and the high-tech infrastructure to drive New York State's innovative ecosystem, as well as significant R&D nodes across the United States, we are thrilled to be able to share AIM's opportunities with the many researchers and business leaders at SEMICON West," said Dr. Liehr. "During this year's engagement, AIM Photonics is eager to share updates related to the development of the TAP facility in Rochester, New York, as well as its latest offerings which can enable meaningful, cost-effective collaborations via the leveraging of the initiative's PDK (Process Design Kit) and MPW (Multi Project Wafer) capabilities."

A New York Nanotechnology Summit, scheduled to take place on Wednesday 12 July will provide SEMICON West participants with an opportunity to network and learn more about New York State's research and business opportunities in the nanotechnology sector, especially as it relates to semiconductor, integrated photonics, power electronics, packaging, and other nanotechnology-related R&D and commercialization efforts. Representatives from AIM Photonics, NY-PEMC, SUNY Poly, New York Economic Development Agencies, and industry leaders IBM, GE, TEL, Mentor, Infinera, Coventor, Cadence, and Eastman Business Park will offer key technology insights, program updates, and information about future partnership and business opportunities, in addition to details about shovel ready, cost-effective and efficient locations for companies that are looking for growth.

Additionally, at this year's SEMICON West engagement, NY-PEMC representatives will also provide presentations detailing the initiative's progress as SUNY Poly, in partnership with General Electric, drive the high volume manufacturing and packaging of power electronic devices and systems comparing to current silicon-based computer chips. The presentations will offer details related to the successful first production of silicon carbide-based patterned wafers at the NY-PEMC's 150mm SiC foundry, which was announced in February. For example, NY-PEMC's Brian Sapp will present, "The New York Power Electronics Manufacturing Consortium: Enabling the Power Electronics Revolution," which will offer further insight into SUNY Poly's Albany NanoTech Complex and its power electronics capabilities, as well as the state-of-the-art power electronics packaging facility at SUNY Poly's Computer Chip Commercialization Center (Quad-C) fab, which is located in Utica, New York, where partner Danfoss Silicon Power will package modules and power blocks for industrial, automotive, and renewable energy applications.


Lightwave Logic receives ECOC Innovation Award for Hybrid PIC/Optical Integration Platform
Coherent wins ECOC award for datacentre innovation
HyperLight announces $37 million funding round
Jabil expands silicon photonics capabilities
Ephos raises $8.5 million for glass-based photonic chips
Designing for manufacture: PAM-4 transmitters using segmented-electrode Mach-Zehnder modulators
OpenLight and Epiphany partner on PIC ecosystem
NewPhotonics and SoftBank team up on advanced photonics
POET and Mitsubishi collaborate on 3.2T optical engines
Integrated photonic platforms: The case for SiC
Integrating high-speed germanium modulators with silicon photonics and fast electronics
Lightium Secures $7 Million Seed Funding
Revolutionising optoelectronics with high-precision bonding
Fraunhofer IMS invites participation in PIC engineering runs
Advances in active alignment engines for efficient photonics device test and assembly
Aeva announces participation at IAA Transportation 2024
Sumitomo Electric announces participation in ECOC 2024
Quside receives NIST certification for quantum entropy source
DustPhotonics launches industry-first merchant 1.6T silicon photonics engine
Arelion and Ciena announce live 1.6T wave data transmission
DGIST leads joint original semiconductor research with the EU
POET Technologies reorganises engineering team
A silicon chip for 6G communications
South Dakota Mines wins $5 million from NSF for Quantum Materials Institute
HieFo indium phosphide fab resumes production
Coherent launches new lasers for silicon photonics transceivers
AlixLabs wins funding from PhotonHub Europe
Sandia National Labs and Arizona State University join forces
Perovskite waveguides for nonlinear photonics
A graphene-based infrared emitter
Atom interferometry performed with silicon photonics
A step towards combining the conventional and quantum internet

×
Search the news archive

To close this popup you can press escape or click the close icon.
Logo
x
Logo
×
Register - Step 1

You may choose to subscribe to the PIC Magazine, the PIC Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in: