Loading...
News Article

MIT to host AIM Photonics summer academy on PIC fundamentals

News

Course consists of a mix of lectures, demonstrations and design challenges that explore the creation and application of photonic integrated circuits (PICs)

AIM Photonics Academy -- the educational initiative of the AIM Photonics Institute, a USA Advanced Institute for Manufacturing -- will offer three- and five-day intensive courses in the fundamentals of integrated photonics over the period July 24-28 at Massachusetts Institute of Technology, Cambridge, US.

At the summer 2017 event, attendees will have the opportunity to learn about
- photonic materials properties, performance and device processing
- design principles for integrated photonic devices
- photonic circuit architectures for the silicon platform and its system applications
- manufacturing constraints and guidelines for high volume manufacturing

And the course consists of a mix of lectures, demonstrations and design challenges covering topics such as principles of planar waveguide devices; passive and active integrated photonic devices; monolithic and hybrid chip process flow; electronic-photonic co-design; manufacturing data analytics; as well as chip test and packaging.

More details, including a list of frequently asked questions, can be found on the MIT Microphotonics Center website.


Lightwave Logic receives ECOC Innovation Award for Hybrid PIC/Optical Integration Platform
Coherent wins ECOC award for datacentre innovation
HyperLight announces $37 million funding round
Jabil expands silicon photonics capabilities
Ephos raises $8.5 million for glass-based photonic chips
Designing for manufacture: PAM-4 transmitters using segmented-electrode Mach-Zehnder modulators
OpenLight and Epiphany partner on PIC ecosystem
NewPhotonics and SoftBank team up on advanced photonics
POET and Mitsubishi collaborate on 3.2T optical engines
Integrated photonic platforms: The case for SiC
Integrating high-speed germanium modulators with silicon photonics and fast electronics
Lightium Secures $7 Million Seed Funding
Revolutionising optoelectronics with high-precision bonding
Fraunhofer IMS invites participation in PIC engineering runs
Advances in active alignment engines for efficient photonics device test and assembly
Aeva announces participation at IAA Transportation 2024
Sumitomo Electric announces participation in ECOC 2024
Quside receives NIST certification for quantum entropy source
DustPhotonics launches industry-first merchant 1.6T silicon photonics engine
Arelion and Ciena announce live 1.6T wave data transmission
DGIST leads joint original semiconductor research with the EU
POET Technologies reorganises engineering team
A silicon chip for 6G communications
South Dakota Mines wins $5 million from NSF for Quantum Materials Institute
HieFo indium phosphide fab resumes production
Coherent launches new lasers for silicon photonics transceivers
AlixLabs wins funding from PhotonHub Europe
Sandia National Labs and Arizona State University join forces
Perovskite waveguides for nonlinear photonics
A graphene-based infrared emitter
Atom interferometry performed with silicon photonics
A step towards combining the conventional and quantum internet

×
Search the news archive

To close this popup you can press escape or click the close icon.
Logo
x
Logo
×
Register - Step 1

You may choose to subscribe to the PIC Magazine, the PIC Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in: