Loading...
News Article

Luceda Photonics to deliver PIC design class

News

The five day visit, which includes an industry seminar and training, is organized by the Chinese Ministry of Industry and Information Technology in cooperation with imec, Ghent University and Luceda Photonics.

Next month, members of imec spin-off Luceda Photonics travel to Xiamen in southeastern China where the Belgium-based provider of design software for photonic integrated circuits (PICs) will join other optics experts for an industry seminar on 21 May 2017.

Participants at the event -- organized by the Chinese Ministry of Industry and Information Technology, in cooperation with imec, Ghent University and Luceda Photonics -- include representatives from SiFotonics, Hisense, Accelink, Nantong Optoelectroncis Center - Chinese Academy of Science, Semiconductor Institute - Chinese Academy of Science, Huawei Hisilicon, ZTE optoelectronics, imec and Fraunhofer HHI.

Tutorial opportunities
Training follows the seminar, beginning with a two-day course on integrated photonics led by Roel Baets of imec and Ghent University. And then on 24-25 of May, Pierre Wahl of Luceda Photonics is scheduled to deliver a class on designing silicon photonics.

Lightwave Logic receives ECOC Innovation Award for Hybrid PIC/Optical Integration Platform
Coherent wins ECOC award for datacentre innovation
HyperLight announces $37 million funding round
Jabil expands silicon photonics capabilities
Ephos raises $8.5 million for glass-based photonic chips
Designing for manufacture: PAM-4 transmitters using segmented-electrode Mach-Zehnder modulators
OpenLight and Epiphany partner on PIC ecosystem
NewPhotonics and SoftBank team up on advanced photonics
POET and Mitsubishi collaborate on 3.2T optical engines
Integrated photonic platforms: The case for SiC
Integrating high-speed germanium modulators with silicon photonics and fast electronics
Lightium Secures $7 Million Seed Funding
Revolutionising optoelectronics with high-precision bonding
Fraunhofer IMS invites participation in PIC engineering runs
Advances in active alignment engines for efficient photonics device test and assembly
Aeva announces participation at IAA Transportation 2024
Sumitomo Electric announces participation in ECOC 2024
Quside receives NIST certification for quantum entropy source
DustPhotonics launches industry-first merchant 1.6T silicon photonics engine
Arelion and Ciena announce live 1.6T wave data transmission
DGIST leads joint original semiconductor research with the EU
POET Technologies reorganises engineering team
A silicon chip for 6G communications
South Dakota Mines wins $5 million from NSF for Quantum Materials Institute
HieFo indium phosphide fab resumes production
Coherent launches new lasers for silicon photonics transceivers
AlixLabs wins funding from PhotonHub Europe
Sandia National Labs and Arizona State University join forces
Perovskite waveguides for nonlinear photonics
A graphene-based infrared emitter
Atom interferometry performed with silicon photonics
A step towards combining the conventional and quantum internet

×
Search the news archive

To close this popup you can press escape or click the close icon.
Logo
x
Logo
×
Register - Step 1

You may choose to subscribe to the PIC Magazine, the PIC Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in: