Info
Info
News Article

Simulations Evaluate Variations In PIC Manufacturing

News

Academia and industry join forces to tackle two challenges of photonic integrated circuit (PIC) design: characterizing manufacturing variations and predicting their influence on circuit performance.

By James Tyrrell

Researchers based at the University of British Columbia together with engineers from Lumerical Solutions have developed an enhanced Monte Carlo (MC) simulation methodology to predict the impacts of layout-dependent correlated manufacturing variations on the performance of photonics integrated circuits (PICs).

“Typically, a digital circuit will work if all of its components operate properly. However, most photonic designs are analog circuits; as a result, photonics yield analysis is based on circuit performance rather than single device performance, which is similar to that of analog electronics," comments the team.

Reporting its results in the journal Optics Express, the group tackles two challenges of PIC designs: characterizing manufacturing variations and predicting circuit performance under the impacts of correlated manufacturing variations.

“We have demonstrated a simple and accurate characterization method for the manufacturing variations of PICs, which extracts the waveguide width and height from the spectral response of a single racetrack resonator," write the authors in their paper. “Using this method, we have measured the spectral responses of 2074 identical racetrack resonators on a 200-mm-wafer that was fabricated through a 248-nm DUV lithography photonics process, and we extracted the waveguide width and height at each device location on the wafer."



Info

The team then fed this information into simulation flows and models to predict the performance of PICs under the impact of correlated manufacturing variations.




Reference -

Opt. Express 25 9712-9733 (2017) [open access]




Info
Infinera Reports Q4 and 2016 year Results
NTT team advances photonics integration
VPIphotonics and PhoeniX Software integrate solutions based on LioniX International TriPleX technology
Infinera Introduces Instant Network product
RETN Deploys Infinera Cloud Xpress in Europe
Imec demonstrates 896Gb/s photonics transceiver
Lumentum to Exhibit at Four Tradeshows this quarter
Tyndall to lead world's first photonics packaging pilot line
POET Reports $1.86 million in sales for 2016
TowerJazz Announces New Process for optical transceivers
German carrier boosts capacity with Infinera Cloud Xpress
Kaiam to acquire British III-V Facility
Qorvo Launches PAM4 Family for Datacentres
Dutch researchers develop 1,000 times more efficient nano-LED
Sherwin Cabatic joins Kaiam as Vice President of Sales
Optical amplifier is smaller than a paper clip
Emcore Announces products for Next Generation Networks
Industry Group Forms Multi-Source Agreement for Shortwave WDM
The PIC movement is gaining momentum in the marketplace
Phoenix Announces new OptoDesigner Release
UCSB researchers demonstrate chip-scale optical frequency synthesis
Lumentum reports record revenue of $265 million
Lumentum to Exhibit at Five Tradeshows in Three Months
PhoeniX announces five day course on photonic chip design
Sherwin Cabatic joins Kaiam Corporation
PhoeniX and Synopsys to show PIC software at SPIE Photonics West
Fraunhofer Group and Leibniz Association to collaborate on future technology
Emcore turns in a solid quarter
Lumentum Enhances 100G Long-Reach Datacom Portfolio
ECIX uses Infinera Cloud Xpress to connect Datacentres

Info
Your firstname
Your lastname
Next »Close
 
×
Logo
Search the news archive

To close this popup you can press escape or click the close icon.
×
PIC Magazine

Login

Email

Password

Not yet registered?

To close this popup you can press escape or click the close icon.
Logo
×
X
Info
X
Info