Info
Info
Info

IBM Teams Up With AIM Photonics

News

Information technology giant joins initiative to enable advanced packaging designs and manufacturing of photonic integrated circuits (PIC). Announcement also includes IP licensing agreement.

The American Institute for Manufacturing Integrated Photonics (AIM Photonics) has announced a patent and intellectual property licensing agreement with IBM and confirmed that IBM has joined its photonics consortium. AIM Photonics views this as another significant step in the advancement of the silicon photonics industry in upstate New York.


The collaboration between IBM and AIM Photonics is expected to provide a path for the development of new technologies and products that will further solidify the consortium's position in the integrated photonics manufacturing ecosystem.


Additionally, the intellectual property licensing agreement with IBM will help AIM Photonics establish standard processes in the development of silicon photonics assemblies, such as couplings for communication signals and light sources. Industry and academic AIM Photonics members will access these technologies through a process design kit (PDK) and prototype development at the Rochester Test Assembly and Packaging (TAP) facility and the 300mm chip facility at SUNY Poly's Albany campus.


One of AIM Photonics' primary goals is to make Rochester a technology hub for silicon photonics manufacturing and packaging, generating both growth and job opportunities for the city of Rochester, Monroe County, and the State as a whole.



Info


"Today's announcement furthers New York State's global leadership in developing next-generation integrated silicon photonics technologies," said Michael Liehr, AIM Photonics CEO and SUNY Poly Executive Vice President of Innovation and Technology and Vice President of Research. "Working side by side with IBM photonic PIC and packaging experts is a significant milestone for AIM Photonics as we continue to advance our capabilities and prepare the TAP facility."


Through its membership, IBM will contribute to the development of AIM Photonics' advanced integrated silicon photonics technology, packaging services, and other future offerings to make advanced technology available to AIM Photonics members and the wider technical community. IBM, together with the other industry partners and the affiliated universities, will play a significant role to direct advanced research activities of AIM Photonics towards new products.


Related reading -

Q&A: exploring the use of integrated optical platforms in IT and beyond (PIC International magazine, issue #2)


Core-Backbone Deploys Infinera Cloud Xpress 2
IQE Reports Continued Double-digit Photonics Growth
Promising European Photonics Results Are In
AIM Photonics Welcomes Mentor As Newest Tier 1 Member
PLAT4M Matures Three Silicon Photonic Platforms
Lumileds Officially An Independent Company
Physik Instrumente Inaugurates New Technology Center
ADVA Optical Networking Enters Into Agreement To Acquire MRV Communications
AIM Photonics And NY-Power Electronics Manufacturing Consortium Highlight Collaboration At SEMICON West 2017
Coriant Solution Enhances Broadband Services Of Frontier Communications
UK’s Silicon Photonics Consortium Welcomes £4.8 Million Boost To R&D Innovation Funding
Infinera Provides On-demand Terabit Capacity For Subsea Services
Mentor And PhoeniX Software Offer New Integration To Speed Up Tape-Out Time For Photonics Circuits
Infinera Delivers 19 Terabits On Trans-Atlantic Route
Lightwave Logic Advances High-Speed Modulation Performance With Polymer PIC Platform
Coriant Appoints Khaled Zeidan As Managing Director, Middle East And Africa
IMECAS Develops New Silicon Photonics Platform In China
Juniper Networks Appoints New Chief Technology Officer
POET Announces Strategy And Roadmap At AGM
Aurora Semiconductor And BRIDG Form Strategic Alliance For High Technology 200mm Wafer Production
University Of Twente Develops Record Laser On Chip
Coriant Selected To Modernize Chile’s National Research And Education DWDM Backbone Network
University Of Twente Develops Narrowest Band Diode Laser
Photonics Worth £12.9B To The UK Economy

Info
Your First Name
Your Email Address
Next »Close
 
×
Search the news archive

To close this popup you can press escape or click the close icon.
Logo
×
Logo
×
Register - Step 1

You may choose to subscribe to the PIC Magazine, the PIC Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in:
 
X
Info
X
Info