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Imec Presents 896 Gb/s Silicon Photonics Transceiver At OFC 2017

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Only a few square millimetres, imec's 896Gb/s silicon photonics spatial-division multiplexing transceiver is aimed at future Tb/s optical links to combine newly developed 50GHz active optical components with a multi-core fibre.

The bi-directional silicon photonics transceiver combines dense arrays of 56Gb/s Germanium-Silicon (GeSi) electro-absorption modulators (EAMs) and GeSi waveguide photodetectors (PDs) (16 GeSi EAMs and 16 GeSi PDs) implemented with a 100µm channel pitch on a single silicon chip and interfaced with a multi-core fibre. Both the EAM and PD devices are realized in a single GeSi epitaxial growth step, to enable a simple fabrication scheme.

The chip co-integrates optical power splitters to feed a single laser source to the transmitter channels, and a dense array of fibre grating couplers to interface with a pitch reducing optical fibre array (PROFA), provided and packaged by Chiral Photonics.

"We obtained clear and wide open eye diagrams at 56Gb/s non-return-to-zero on-off keying (NRZ-OOK) data rate, for all EAM and PD channels tested in a loop-back transmission experiment," said Joris Van Campenhout, director of the Optical I/O R&D program at imec. "These results clearly show the potential to realize ultra-compact multi-channel optical transceivers in imec's 50G silicon photonics platform, targeting future Tb/s-scale interconnects."

The GeSi EAM and PD components are available for evaluation by companies and academia through imec's silicon photonics prototyping service and the iSiPP50G multi-project wafer (MPW) service provided by Europractice.

The iSiPP50G platform includes a validated passive and active device library, which is supported by photonic design software solutions from multiple EDA vendors, including Synopsys, Luceda Photonics and Lumerical in current or upcoming releases.

AngelTech Online Summit is now available to watch ON-DEMAND!

AngelTech Online Summit witnessed over 900 registrants for the digital event, which took place virtually on Tuesday 19th May.

The Summit was designed to ensure the global compound semiconductor, integrated photonics, sensors and PIC pilot lines communities could stay connected and would serve as a significant supplement to the annual Brussels face-to-face conference, rescheduled for 17th and 18th November, 2020.

The event included 4 breakout sessions for CS International, PIC International, Sensors International and PIC Pilot Lines respectively.

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