Loading...
News Article

Lumentum places repeat Aixtron order

Multiple AIX 2800G4-TMs will produce devices for optoelectronic and laser applications

Deposition equipment company Aixtron has announced that US- based Lumentum Holdings, a manufacturer of semiconductor photonic devices, has placed a repeat order for multiple AIX 2800G4-TM MOCVD systems to produce devices for varied optoelectronic and laser applications.

The system is designed for GaAs/InP based optoelectronics and p-HEMT/HBT devices

Lumentum's executive VP and COO, Vince Retort, comments: "We have a longstanding business relationship with Aixtron; and, their local system support teams are excellent and very responsive. Following the successful qualification of the first AIX 2800G4-TM system, we decided to expand our production capacity and ordered additional Aixtron tools. We look forward a collaborative relationship with Aixtron in the future."

"Our AIX 2800G4-TM tool supports Lumentum's technology approach by providing excellent on-wafer uniformity control, unique advanced features for wafer-to-wafer temperature control such as AUTOSAT and low precursor consumption. Furthermore, this highly efficient and flexible system offers various wafer configurations from 2-inch to 6-inch", says Bernd Schulte, executive VP and COO at Aixtron SE. 

Lightwave Logic receives ECOC Innovation Award for Hybrid PIC/Optical Integration Platform
Coherent wins ECOC award for datacentre innovation
HyperLight announces $37 million funding round
Jabil expands silicon photonics capabilities
Ephos raises $8.5 million for glass-based photonic chips
Designing for manufacture: PAM-4 transmitters using segmented-electrode Mach-Zehnder modulators
OpenLight and Epiphany partner on PIC ecosystem
NewPhotonics and SoftBank team up on advanced photonics
POET and Mitsubishi collaborate on 3.2T optical engines
Integrated photonic platforms: The case for SiC
Integrating high-speed germanium modulators with silicon photonics and fast electronics
Lightium Secures $7 Million Seed Funding
Revolutionising optoelectronics with high-precision bonding
Fraunhofer IMS invites participation in PIC engineering runs
Advances in active alignment engines for efficient photonics device test and assembly
Aeva announces participation at IAA Transportation 2024
Sumitomo Electric announces participation in ECOC 2024
Quside receives NIST certification for quantum entropy source
DustPhotonics launches industry-first merchant 1.6T silicon photonics engine
Arelion and Ciena announce live 1.6T wave data transmission
DGIST leads joint original semiconductor research with the EU
POET Technologies reorganises engineering team
A silicon chip for 6G communications
South Dakota Mines wins $5 million from NSF for Quantum Materials Institute
HieFo indium phosphide fab resumes production
Coherent launches new lasers for silicon photonics transceivers
AlixLabs wins funding from PhotonHub Europe
Sandia National Labs and Arizona State University join forces
Perovskite waveguides for nonlinear photonics
A graphene-based infrared emitter
Atom interferometry performed with silicon photonics
A step towards combining the conventional and quantum internet

×
Search the news archive

To close this popup you can press escape or click the close icon.
Logo
x
Logo
×
Register - Step 1

You may choose to subscribe to the PIC Magazine, the PIC Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in: