+44 (0)24 7671 8970
More publications     •     Advertise with us     •     Contact us
 
Loading...
News Article

Kaiam launches new LightScale platform at ECOC

News

Advancing performance, density, scalability and ease of manufacturing

Kaiam, who produce high-performance pluggable optical transceivers for datacentres, launched LightScale2, a new platform enabling unprecedented performance and scalability. This planar approach combines multiple transmit and receive blocks in a very dense architecture that is simple to assemble and delivers higher performance than standard TOSA/ROSA approaches. Kaiam is currently sampling CWDM4 100G QSFP28s based on this architecture, and expects to deliver 200G, 400G, and higher density on-board optics with this platform in the future. This development extends Kaiam's leadership in hybrid integration technology for single-mode WDM transceivers.

Kaiam has been shipping 40G and 100G transceivers for hyperscale datacentres in volume since 2014 using a MEMS-aligned hybrid optical integration approach. The company's LightScale1 platform uses this proprietary MEMS technique for optical engines in a standard TOSA/ROSA architecture. LightScale2 flattens the internal architecture of the transceiver to further improve density, RF signal integrity, thermal management, power consumption, and manufacturing simplicity.

Bardia Pezeshki, Kaiam's CEO said: "Today most single-mode transceivers use legacy telecom-type approaches that result in bulky packaging of components. This not only increases cost and manufacturing complexity, but degrades performance, as electrical and optical signals and heat must traverse multiple interfaces.

"Kaiam's MEMS-based packaging is intrinsically dense, combining best-of-breed components such as InP lasers, silicon photonics, and silica-waveguide integrated optics. By liberating our technology from outdated telecom architectures, we can manufacture very dense and high-performance multi-wavelength transceivers and modules. The new 100G QSPF28s being sampled now are a brilliant testament to the advantages of this approach."

Kaiam executives will be available at ECOC to discuss the benefits and potential of the new platform. 

EMCORE announces integration of PICs into its products
Scottish photonics consortium wins £4.7m in UKRI funding
Yuanjie Semiconductor to supply lasers to POET
Fraunhofer IPMS announces government funding for quantum photonic chip
POET Technologies partners with Yuanjie Semiconductor Technology
SiLC announces silicon photonics systems for machine vision
Scientists develop novel optical modulators for integrated photonics
Scientists report integrated photodiodes on TFLN
Coherent wins award for innovative photonics product
FBH to present quantum technology developments at EQTC 2023
Skorpios and FormericaOE demonstrate PICs in 800G optical transceivers
EFFECT Photonics verifies fully integrated InP PIC
NASA awards grant for silicon photonics project
OpenLight and Spark Photonics partner on PIC design services
DustPhotonics announces 800G chip for hyperscale data centres and AI
Lightwave Logic Receives Industry Innovation Award
Imec announces SiGe BiCMOS optical receiver
SiFotonics announces silicon photonics 800G LPO solutions
Rockley Photonics progresses noninvasive biomarker monitoring
MantiSpectra secures €4 million for miniaturised spectrometers
Sivers to demo next-gen laser arrays at ECOC 2023
ASMPT AMICRA and Teramount collaborate on silicon photonics packaging
Quantum Computing Inc. selects Arizona site for photonic chip foundry
German government to fund ams OSRAM optoelectronic semiconductor development
Luceda Photonics introduces new PIC design software
Vodafone explores silicon photonics for future mobile networks
Coherent introduces 1200 mW pump laser module
Photonics startups invited to apply to Luminate NY accelerator
New tool could improve lithography for smaller, faster chips
InP-based lasers surpass 2.2 mm
Indie Semiconductor buys Exalos AG
New technique controls direction and wavelength of emitted heat

×
Search the news archive

To close this popup you can press escape or click the close icon.
Logo
×
Logo
×
Register - Step 1

You may choose to subscribe to the PIC Magazine, the PIC Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in: