Scintil Photonics announces $58 million Series B
The company plans to use the investment to establish a US-based presence to serve hyperscale and AI infrastructure partners more directly, as well as to advance its goal of delivering the industry’s first single-chip DWDM light engine, aligned with next-generation co-packaged optics
Scintil Photonics has announced the completion of a $58 million Series B funding round led by Yotta Capital Partners and NGP Capital, with participation from NVIDIA. The round includes new participation from BNP Paribas Développement, alongside existing investors including Supernova Invest, Bpifrance Digital Venture, Innovacom, Bosch Ventures, and Applied Ventures ITIC Innovation Fund (AVITIC).
Originating from French research institute CEA-Leti, Scintil focuses on solutions to meet the high-bandwidth, low-latency, and high-density demands for next-generation AI infrastructure, delivering the scale, efficiency, and performance required for powerful GPU clusters. The company says its proprietary SHIP (Scintil Heterogeneous Integration Photonics) process technology enables the integration of multiple optical devices, including lasers, photodiodes, and modulators, on a single chip. According to Scintil, this allows dozens of traditionally separate parts to be replaced with a single-chip solution that delivers previously unattainable performance, efficiency, and integration density. The company adds that it has developed the SHIP platform on a commercial supply chain with mass manufacturing capabilities.
With the new funding, Scintil plans to expand hiring in France and internationally, including in the US, accelerate production, and deepen its international presence. Additionally, the investment supports the commercial ramp of LEAF Light, which Scintil describes as the industry’s first dense wavelength division multiplexing (DWDM)-native light engine, aligned with next-generation co-packaged optics (CPO). DWDM-native means the single-chip device can output many precisely spaced and multiplexed wavelengths, dramatically increasing bandwidth and decreasing energy requirements, the company says.
Built on Scintil’s SHIP platform, LEAF Light aims to enable low-power, high-density optical connectivity, delivering 6.4T/mm edge bandwidth density today, at roughly one sixth the power consumption of conventional pluggable solutions. It’s designed for scale-up GPU clusters and emerging AI systems, with reference packaging and integration support to accelerate deployment.
“This investment marks a pivotal moment for Scintil as we move to full-scale deployment,” said Matt Crowley, CEO of Scintil Photonics. “Our SHIP technology enables integrated photonic solutions with the scalability, energy efficiency, and integration density required to power next-generation compute infrastructure. This efficiency not only reduces datacentre operating costs but also contributes to lowering the carbon footprint of AI infrastructure. With LEAF Light entering high-volume production, we’re expanding from our base in Grenoble into the international markets, including the US, to support the world’s most advanced AI factories.”
Sylvie Menezo, founder and CTO of Scintil Photonics, said: “We developed our LEAF Light integrated circuit in close collaboration with our customers. Used as an external laser source for co-packaged optics (CPO) transmissions, it is a key component for the next generation of AI datacentres. Its uniqueness lies in a single-chip solution that monolithically integrates precisely spaced DFB lasers on silicon photonic circuits, produced through a robust commercial supply chain. Our SHIP technology provides a strong and disruptive foundation to expand our portfolio of integrated photonic circuit solutions for the coming decades.”
Vincent Deltrieu, managing partner at Yotta Capital Partners, commented: “Scintil exemplifies the kind of innovation leaders we look for, combining advanced manufacturing, deep-tech leadership, and meaningful impact on the energy demands of AI infrastructure. Scintil’s integrated photonics platform is essential to scale the next generation of AI factories. We’re excited to support their global growth as they move to high-volume shipments.”
