izmomicro announces new silicon photonics packaging solution
The company, which is a specialised division of izmo Ltd., says this milestone underscores its role as a pioneer in India’s semiconductor ecosystem and the global race toward next-generation AI infrastructure
izmomicro, a specialised division of izmo Ltd., has announced that it has developed a high-density silicon photonics packaging platform capable of supporting 32-channel fibre input and output with an insertion loss of less than 2 dB. According to the company, achieving this density demands nanometre-scale optical alignment, advanced assembly processes, and seamless integration of electronics, making it a major challenge in the industry.
The module also incorporates 32 DC I/Os, 4 RF I/Os, izmomicro adds, as well as high-speed RF performance up to 70 GHz, which the company says is a new benchmark for the integration of photonic and electronic systems. With this new solution for density and precision challenges in silicon photonics, izmomicro aims to address a critical bottleneck for the industry and position itself among a select group of companies worldwide capable of delivering this capability.
Delivering high-density integration with ultra-low signal loss is central to the evolution of AI, cloud computing, and telecommunications. As traditional copper interconnects approach their physical limits, silicon photonics has emerged as the enabling technology for multi-terabit optical communication. By breaking through packaging constraints, izmomicro says it is helping unlock the scalability and efficiency required for hyperscale datacentres, AI clusters, and next-generation 5G/6G networks.
“Achieving this level of fibre density with ultra-low insertion loss is a defining moment for izmomicro,” said Dinanath Soni, executive director of izmomicro. “Only a handful of companies worldwide have demonstrated this capability, and we are proud to be the first in India. This breakthrough validates our years of R&D in precision packaging and positions us as a critical partner for the global silicon photonics industry. As AI and data-driven applications demand ever-higher performance, our innovation will help power the infrastructure of the future.”
