Xanadu and DISCO collaborate on wafer processing for PICs
The photonic quantum computing company says this partnership will advance techniques for achieving ultra-smooth surfaces and reducing optical losses, playing a pivotal role in realising utility-scale photonic quantum computers
Xanadu, a photonic quantum computing company, and DISCO Corporation, a precision machine and processing tool manufacturer, have announced they are developing advanced wafer processing techniques for ultra-low-loss PICs. This partnership focuses on enhancing wafer dicing processes, specialised wafer preparation for heterogeneous integration and assembly, as well as achieving ultra-smooth surfaces through polishing optimisation. These capabilities are critical for high-performance PICs and to enable the scalability of photonic chip packaging for quantum and other cutting-edge photonic applications.
According to the companies, high-quality wafer dicing achievable with DISCO's machinery is essential for photonic chip singulation and contributes to reducing optical losses. In addition, DISCO's advanced dicing process aims to eliminate the need for manual polishing, streamlining the manufacturing process of photonic chips and further facilitating scaling to high-volume photonic packaging. Xanadu says it is also leveraging DISCO's industry-leading Kiru (cutting), Kezuru (grinding) and Migaku (polishing) technologies to enable wafer preparation for heterogeneous integration. These processes are critical to meeting the stringent requirements of photonic chip performance. Optimal polishing processes are key to achieving the ultra-smooth surfaces required for minimising optical loss.
“DISCO Corporation has been a vitally important partner for us over the years,” said Christian Weedbrook, founder and CEO of Xanadu. “Our close collaboration with DISCO Corporation has helped us continuously push the boundaries of photonic packaging capabilities with their leading-edge dicing, grinding, and polishing solutions. These capabilities are significant contributions towards achieving our goal of a utility-scale photonic quantum computer.”
Steve Latina, technical solution lead and account manager at DISCO USA, added: “Xanadu's efforts are driving advancement not just in quantum compute, but the industry as a whole – from equipment and foundry process, to materials. Sharing the paradigm 'every photon counts' has a trickle-down effect, challenging their partners to achieve never-before-seen feats. DISCO is uniquely positioned to support Xanadu and growing market demand for highly clean, highly precise, and highly intelligent manufacturing.”
