POET Technologies, designer and developer of the POET Optical Interposer and Photonic Integrated Circuits (PICs) for the data center and tele-communication markets, has announced that it has extended the Optical Interposer into new applications and markets with a fully-integrated, multiplexed light-source for optical computing chipsets and sensing applications, named “LightBar-C”.

The POET Optical Interposer platform has been extended and validated with the intrinsic features to support Conventional Band (“C-band”) and Long Band (“L-band”) lasers that produce light in a frequency range of 1530nm to 1625nm. POET has designed, developed and demonstrated cooled lasers for the Optical Interposer platform with up to 90mW of power operating at room temperature. In addition, the Company has designed and demonstrated a Dense Wavelength Division Multiplexer (“DWDM”) embedded in the Optical Interposer waveguide layer that allows channel spacings of 200GHz, providing the high density and broadband requirements needed for high-performance optical sensing and Co-Packaged Optics (CPO) applications, such as optical computing chipsets for Artificial Intelligence.

The Company's first product to incorporate all of these features is the POET LightBar-C, which includes integrated spot-size converters that minimize coupling losses and increase power efficiency of components, such as multiplexers and detectors. The product provides low-loss fiber and free-space coupling, all specifically developed for highly integrated solutions within the C-band frequencies. The LightBar-C also utilizes a versatile and integrated laser source with multiple wavelengths (from 2 up to 8) multiplexed in the C-Band.

The optical bandwidth in the C-band is in the “eye-safe” region, which makes it ideal for free-space sensing applications. Consequently, C-band light solutions are expected to be foundational to the next generation of LiDAR solutions where high sensitivity, high power, reduced atmospheric influence and eye safety are presumed to be essential requirements.

“The mega trends of Cloud Computing, 5G Communications and the rapid growth of Artificial Intelligence are spawning numerous applications and driving increasing volume demands for both high-performance lasers and integrated photonics solutions. These applications require a step function improvement in packaging and scalability,” commented Dr. Suresh Venkatesan, Chairman & CEO of POET Technologies. “Current photonics products are still assembled and tested using conventional and esoteric packaging technologies that ultimately limit production scalability. POET's Optical Interposer addresses key integration and scalability challenges with a unified wafer-scale hybrid integration platform that seamlessly merges the benefits of Planar Lightwave Circuits (PLCs) and electrical interposer functionality for co-packaging electronics and optics within a single chip-scale package.”

As with previously announced Optical Interposer-based solutions, POET's unique method of hybrid integration enables products with small form-factors and high performance. POET's wafer-scale hybrid integration approach simplifies the manufacturing, assembly and testing of the passively assembled optical sub-system while simultaneously maximizing power efficiency with reduced coupling losses through the complete link.

The extensibility to the C-band frequency range comprised of 15xx wavelengths of light further exemplifies the value of the Company's hybrid platform approach, as the same fundamental Optical Interposer manufacturing process and design kits can be utilized to deliver solutions across a wide range of applications.

AngelTech Live III: Join us on 12 April 2021!

AngelTech Live III will be broadcast on 12 April 2021, 10am BST, rebroadcast on 14 April (10am CTT) and 16 April (10am PST) and will feature online versions of the market-leading physical events: CS International and PIC International PLUS a brand new Silicon Semiconductor International Track!

Thanks to the great diversity of the semiconductor industry, we are always chasing new markets and developing a range of exciting technologies.

2021 is no different. Over the last few months interest in deep-UV LEDs has rocketed, due to its capability to disinfect and sanitise areas and combat Covid-19. We shall consider a roadmap for this device, along with technologies for boosting its output.

We shall also look at microLEDs, a display with many wonderful attributes, identifying processes for handling the mass transfer of tiny emitters that hold the key to commercialisation of this technology.

We shall also discuss electrification of transportation, underpinned by wide bandgap power electronics and supported by blue lasers that are ideal for processing copper.

Additional areas we will cover include the development of GaN ICs, to improve the reach of power electronics; the great strides that have been made with gallium oxide; and a look at new materials, such as cubic GaN and AlScN.

Having attracted 1500 delegates over the last 2 online summits, the 3rd event promises to be even bigger and better – with 3 interactive sessions over 1 day and will once again prove to be a key event across the semiconductor and photonic integrated circuits calendar.

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