Thursday 13th October 2011
The US-based provider of digital optical communications systems has successfully used its DTN platform, which feature indium phosphide PICs, to complete the world's first transpacific 100 Gigabit subsea trial.
Wednesday 21st September 2011
Infinera will use the new reactor to manufacture indium phosphide based photonic integrated circuits for the telecoms sector.
Friday 16th September 2011
The indium phosphide based DTN-X platform addresses global service provider demands for scalable, simple and efficient next-generation optical networks.
Tuesday 23rd August 2011
The facility in Hong Kong is aimed at demonstrating the firm's indium phosphide digital optical network innovation as Infinera expands in the APAC.
Tuesday 9th August 2011
The indium aluminium gallium arsenide / indium phosphide microlasers have achieved continuous-wave (CW) electrically injecting single-mode-operation at room temperature.
Tuesday 2nd August 2011
SEACOM, a leading pan-African telecommunications provider, has used Infinera's indium phosphide PICs to achieve what both firms believe is the first ever 500Gb/s successful trial in Africa.
Thursday 21st July 2011
The new 10X10 MSA compliant module is enabled by photonic integrated architecture and is claimed to slash costs and power by 50%.
Thursday 16th June 2011
The company is responding to increased demand for volume shipments of high-speed coherent fibre optic transport systems.
Friday 10th June 2011
In its collaboration with Interoute, Infinera which uses indium phosphide technology in its PICs, won the award for its contribution to high capacity European networks.
Wednesday 25th May 2011
On the busy Paris-Lyon driving route, Infinera's PICs, which incorporate InP, offer a large capacity and rapid response for data transmission.
Tuesday 17th May 2011
The collaboration will integrate optics and electronics to develop innovative green technology to enable faster computer chips that use significantly less power and result in the creation of 20 high-tech jobs.
Wednesday 11th May 2011
The Development Authority in the U.S.A has selected Infinera for its optical network upgrade.
Tuesday 3rd May 2011
Although revenues fell by only 3% over the same quarter last year, they also plummeted by 20% compared to the previous quarter.
Thursday 10th March 2011
The research arm of Alcatel-Lucent showcased the InP photonic integrated circuits (PICs) at OFC and NFOEC in California.
Thursday 3rd March 2011
The compact PM-QPSK InP devices integrate two matched 90 degree optical hybrids, four high speed balanced detector pairs and four differential linear TIAs with manual and automatic gain control.
Wednesday 2nd March 2011
Infinera's InP monolithic PIC contains more than 150 optical components, which are all integrated onto a single chip smaller than a fingernail.
Wednesday 26th January 2011
The transaction includes secondary purchases from several existing shareholders and equity investment in the company to drive growth and expansion.
Monday 27th September 2010
The multi-university-industry consortium will focus on innovative basic research in the field of photonics including InP Photonic Integrated Circuit (PIC) technology.
Tuesday 21st September 2010
The integrated module capability enables programmable multi-service OTN switching throughout the network.
Tuesday 21st September 2010
The latest modules support the requirements of the OIF implementation agreement on 100G integrated polarization intradyne coherent receivers.
Friday 3rd September 2010
The firm has completed a field trial on the XO Communication Network using its Indium Phosphide based Photonic Integrated Circuits (PICs).
Wednesday 1st September 2010
Featuring an on-site lab, the firm hopes localized, on-site support and regional distribution will streamline quality control and manufacturing processes.
Tuesday 31st August 2010
SPIE eesearchers have used InGaP colloidal quantum dots and unconventional fabrication techniques to produce cheaper, smaller PICs integrated onto a single chip.
Friday 2nd July 2010
Albuquerque based lab reports first successful merger of a terahertz (THz) quantum-cascade laser and diode mixer into a monolithic solid-state transceiver
