PHIXPHIX’ ambition is to become the world’s first automated photonics assembly and packaging line for medium and large volume photonic integrated circuits (PICs), photonic components, assemblies and modules. PHIX will (1) sell photonic components and assemblies, will (2) act as component or module manufacturer and subcontractor for OEM an Tier 1 customers and (3) will provide education and training on photonics assembly and packaging in collaboration with its academic partners. PHIX will provide a state-of-the-art infrastructure in The Netherlands, supporting the European and worldwide industrial development of Photonic Integrated Circuits (PICs). PHIX focuses on a hybrid deployment platform, a platform consisting of two different chips that are planarly assembled and fitted with one or more glass fibers. The designed PICs are made on Indium phosphide or on silicon substrates. Assembly competence of the individual chips is also built up. The hybrid platform has a wider application area and PHIX will standardize some process and assembly steps.
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