+44 (0)24 7671 8970
More publications     •     Advertise with us     •     Contact us
 
Loading...
News Article

CEA-Leti Demo Full Data-Transfer Silicon Photonics Module

News

CEA-Leti announced the demonstration of a fully packaged CWDM optical transceiver module with data transfer of 100 Gb/s per fiber with a low-power-consumption electronic chip co-integrated on the photonic chip. This silicon-photonics-based transceiver multiplexes two wavelengths at 50 Gb/s and is designed to meet the ever-increasing data-communication demands and energy use of data centers and supercomputers.

The EU H2020 project, COSMICC, further developed all the required building blocks for a transmission rate of 200 Gb/s and beyond without temperature control with four 50-Gb/s wavelengths and by aggregating a large number of fibers. The key breakthroughs are the development of broadband and temperature-insensitive silicon nitride (SiN) multiplexing components on silicon (Si), the integration of hybrid III-V/Si lasers on the Si/SiN chips and a new high-count adiabatic fiber-coupling technique via SiN and polymer waveguides.

This demonstration opens the way to technology that allows a reduction in the cost, the power consumption and the packaging complexity and opens the way to reaching a very high aggregated data rate beyond terabits per second (Tb/s).

Starting with STMicroelectronics’ silicon photonics integration platform, the COSMICC project developed a coarse wavelength division multiplexing (CWDM) silicon-photonics transceiver in a packaged module at 100 Gb/s per fiber. It is scalable to 400 Gb/s and includes 3D assembly of a silicon photonic chip and its electronic control chip. The silicon photonic chip integrated high-performance 50 Gb/s NRZ optical modulators and photodetectors, and a two-channel CWDM multiplexer and demultiplexer. The control electronics was optimized to minimize energy consumption down to 5.7 pJ/bit per channel at 50 Gb/s data rate.

Separately, a library of enabling building blocks for higher data-rate datacenter interconnects was built on a SiN-enhanced silicon photonics platform, including new broadband and athermal SiN components and hybrid III-V/Si lasers. SiN, which is 10 times less sensitive to temperature than silicon, will dramatically reduce the transceiver cost and power consumption by eliminating the need for temperature control and will thus contribute to the reduction of the heat output and cooling costs of mega datacenters.

CEA-Leti scientist Ségolène Olivier, who coordinated the EU project, said development of modulators and photodetectors at 50 Gb/s and their co-integration with their control electronics was a breakthrough that led to the low-power consumption 100 Gb/s transceiver module.

“In addition, the new building blocks are essential for addressing the need for terabit-per-second transceivers at low cost and low energy consumption to sustain the exponential growth of data traffic in datacenters and in high performance computing systems,” she explained.

“COSMICC’s technology will answer tremendous market needs with a target cost per bit that traditional WDM transceivers cannot meet,” Olivier said.

In addition to CEA-Leti, COSMICC consortium members include:

  • Industry: STMicroelectronics Italy & France, Vario-Optics, Seagate, Finisar
  • Academic & institutional: Université Paris Sud, Universita di Pavia, University of Southampton Optical Research Center, University of Saint Andrews, Cork Institute of Technology
  • Consultants: Ayming
EMCORE announces integration of PICs into its products
Scottish photonics consortium wins £4.7m in UKRI funding
Yuanjie Semiconductor to supply lasers to POET
Fraunhofer IPMS announces government funding for quantum photonic chip
POET Technologies partners with Yuanjie Semiconductor Technology
SiLC announces silicon photonics systems for machine vision
Scientists develop novel optical modulators for integrated photonics
Scientists report integrated photodiodes on TFLN
Coherent wins award for innovative photonics product
FBH to present quantum technology developments at EQTC 2023
Skorpios and FormericaOE demonstrate PICs in 800G optical transceivers
EFFECT Photonics verifies fully integrated InP PIC
NASA awards grant for silicon photonics project
OpenLight and Spark Photonics partner on PIC design services
DustPhotonics announces 800G chip for hyperscale data centres and AI
Lightwave Logic Receives Industry Innovation Award
Imec announces SiGe BiCMOS optical receiver
SiFotonics announces silicon photonics 800G LPO solutions
Rockley Photonics progresses noninvasive biomarker monitoring
MantiSpectra secures €4 million for miniaturised spectrometers
Sivers to demo next-gen laser arrays at ECOC 2023
ASMPT AMICRA and Teramount collaborate on silicon photonics packaging
Quantum Computing Inc. selects Arizona site for photonic chip foundry
German government to fund ams OSRAM optoelectronic semiconductor development
Luceda Photonics introduces new PIC design software
Vodafone explores silicon photonics for future mobile networks
Coherent introduces 1200 mW pump laser module
Photonics startups invited to apply to Luminate NY accelerator
New tool could improve lithography for smaller, faster chips
InP-based lasers surpass 2.2 mm
Indie Semiconductor buys Exalos AG
New technique controls direction and wavelength of emitted heat

×
Search the news archive

To close this popup you can press escape or click the close icon.
Logo
×
Logo
×
Register - Step 1

You may choose to subscribe to the PIC Magazine, the PIC Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in: