+44 (0)24 7671 8970
More publications     •     Advertise with us     •     Contact us
 
Loading...
News Article

Soitec and MBDA to acquire Dolphin Integration assets

News

Soitec, designer and manufacturer of innovative semiconductor materials, and MBDA, have announced the joint acquisition of Dolphin Integration.

Dolphin Integration is a provider of semiconductor design, silicon IP and SoC (System-On-Chip) solutions for low power applications. Headquartered in Grenoble, Dolphin Integration was founded in 1985. It currently employs 155 people, including 130 design engineers. For the fiscal year ended March 31th, 2018, the company generated revenues of 17 million Euros.

The joint venture formed by Soitec and MBDA acquires Dolphin Integration, including all employees. The resulting ownership of the joint venture is as follows: Soitec at 60% and MBDA at 40%.

The transaction was authorized by the Commercial Court of Grenoble. It comes as a prompt and positive outcome of Dolphin Integration insolvency proceedings. The company went into receivership on July 24, 2018.

Soitec and MBDA each provide complementary strategic support to Dolphin Integration.

Soitec brings its engineered substrates expertise and unique low-power design methodology (body biasing) to accelerate Dolphin Integration design activities in low-power electronic devices, where a growing number of critical chips are built on FD-SOI technology. In addition, Soitec will strengthen Dolphin Integration's position within the entire semiconductor ecosystem, to develop and promote products and services in several strategic markets, including mobile devices and infrastructure, data centers, and space and industrial applications.

MBDA, a strategic customer of Dolphin Integration for defense applications since 2004, strengthens its existing industrial collaboration and long-term commercial pipeline for ASIC (Application Specific Integrated Circuit) and SoC (System on Chip) products. With the support of MBDA, Dolphin Integration will be able to advance its positions in aerospace and defense design.

Soitec and MBDA confident in Dolphin Integration profitable growth.

Soitec and MBDA together committed to a financial investment of around 6 million Euros including the acquisition of most of Dolphin Integration's assets, the payment of certain liabilities and a significant cash injection to finance Dolphin Integration's working capital requirements.

Soitec and MBDA are confident in their ability to turnaround the financial position of Dolphin Integration. Dolphin Integration is expected to be fully consolidated into Soitec's financial statements as of September 2018.

"Dolphin Integration represents a strategic opportunity for Soitec to reinforce a full IP and service offering related to energy efficient solutions for chip design on FD-SOI. This is a major differentiating factor for FD-SOI and a key accelerator of FD-SOI adoption in major market segments," highlighted Paul Boudre, CEO of Soitec.

"MBDA investment will strengthen the French defense industrial base since it will provide Dolphin Integration with a more stable flow of defense related revenues and a closer technological collaboration that will allow it to enhance the access of its specialized microelectronics offering to the entire French and European defense industry," said Antoine Bouvier, CEO of MBDA.

EMCORE announces integration of PICs into its products
Scottish photonics consortium wins £4.7m in UKRI funding
Yuanjie Semiconductor to supply lasers to POET
Fraunhofer IPMS announces government funding for quantum photonic chip
POET Technologies partners with Yuanjie Semiconductor Technology
SiLC announces silicon photonics systems for machine vision
Scientists develop novel optical modulators for integrated photonics
Scientists report integrated photodiodes on TFLN
Coherent wins award for innovative photonics product
FBH to present quantum technology developments at EQTC 2023
Skorpios and FormericaOE demonstrate PICs in 800G optical transceivers
EFFECT Photonics verifies fully integrated InP PIC
NASA awards grant for silicon photonics project
OpenLight and Spark Photonics partner on PIC design services
DustPhotonics announces 800G chip for hyperscale data centres and AI
Lightwave Logic Receives Industry Innovation Award
Imec announces SiGe BiCMOS optical receiver
SiFotonics announces silicon photonics 800G LPO solutions
Rockley Photonics progresses noninvasive biomarker monitoring
MantiSpectra secures €4 million for miniaturised spectrometers
Sivers to demo next-gen laser arrays at ECOC 2023
ASMPT AMICRA and Teramount collaborate on silicon photonics packaging
Quantum Computing Inc. selects Arizona site for photonic chip foundry
German government to fund ams OSRAM optoelectronic semiconductor development
Luceda Photonics introduces new PIC design software
Vodafone explores silicon photonics for future mobile networks
Coherent introduces 1200 mW pump laser module
Photonics startups invited to apply to Luminate NY accelerator
New tool could improve lithography for smaller, faster chips
InP-based lasers surpass 2.2 mm
Indie Semiconductor buys Exalos AG
New technique controls direction and wavelength of emitted heat

×
Search the news archive

To close this popup you can press escape or click the close icon.
Logo
×
Logo
×
Register - Step 1

You may choose to subscribe to the PIC Magazine, the PIC Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in: