MRSI Launches High Speed Die Bonder for Photonics Manufacturing
MRSI-HVM3 designed to help customers meet demand from applications ranging from datacentres to advanced optical sensors
MRSI Systems, a US manufacturer of fully automated die bonding and epoxy dispensing systems, is launching a new high speed die bonder, MRSI-HVM3, to support photonics customers' high volume manufacturing requirements.
MRSI Systems says its customers need to scale up manufacturing to unprecedented levels for advanced applications such as datacentre, telecommunication upgrades to 100G+, 5G wireless, IoT, and advanced optical sensors. The MRSI-HVM3, a high speed, flexible, 3 micron die bonder, has been built to address this challenge.
"The new MRSI-HVM3 incorporates the latest hardware and software innovations. Equipped with ultrafast-ramp eutectic stations, it deploys multiple levels of parallel processing utilising dual gantries, dual heads, dual bonding stages, and "on-the-fly" tool change," explained Yi Qian, VP of product management:
MRSI's platform software is designed to make it easy users to change process settings on their own for new parts, new processes, and new products. The MRSI-HVM3 supports many applications including chip-on-carrier (CoC), chip-on-submount (CoS), and chip-on-baseplate or board (CoB).
MRSI Systems is exhibiting at CIOE with our Chinese Representative CYCAD Century Science and Technology (Booth #1C66) in Shenzhen, September 6-9, 2017.
