Aurora Semiconductor and BRIDG Form Strategic Alliance for High Technology 200mm Wafer Production
Aurora Semiconductor, LLC and BRIDG have signed a Letter of Intent to collaborate in the Osceola based Public-Private Partnership to support the technology development and manufacturing deployment of Aurora's 4D Heterogenous System in Package (4DHSiPTM) technology.
Aurora's 4DHSiPTM technology is designed to enable the placement of over 100 components in a single package the size of a thumb nail, with the thickness of a credit card. This package can be stacked up to 5 high, containing 500 components and 70 interconnect layers on a heterogenous basis, serving to reduce size, weight and power consumption, and to generate tremendous potential for 4DHSiPTM in markets such as aerospace, interconnect systems, medical, servers, internet of things, smart machines and automotive.
"We are tremendously excited about our strategic alliance with BRIDG. This relationship will provide Aurora with access to the 200mm fab capacity essential for our 4DHSiPTM growth strategy to be fully-optimized economically. It will also enable Aurora to better-network with sources of funding to support the infrastructure necessary to drive 4DHSiPTM into its target markets. We could not ask for a better partner", stated Gary Breton, CEO of Aurora Semiconductor.
BRIDG's 109,000 sq. ft. state-of-the-art facility in NeoCity, FL includes approx. 40,000 sq. ft. of clean room laboratory/manufacturing space for use by its industry partners. BRIDG deploys a collaboration model within the manufacturing facility, which focuses on semiconductor-based processes for smart sensors, photonic technologies, and next generation integrated devices.
"This latest partnership with Aurora is a perfect example of how the investments made in establishing the BRIDG infrastructure enable business to grow and expand product offerings while building the foundation for more high tech job opportunities in Florida. We are proud to collaborate with Aurora and continue building strategic alliances in support of innovation", stated Chester Kennedy, CEO of BRIDG.
