Matched-funding available to extend PIC progress
US integrated photonics manufacturing initiative highlights hot topics in its latest call for proposals
By James Tyrrell
AIM Photonics looks to support novel advanced manufacturing capabilities and further the development of a sustainable integrated photonics supply chain in its latest call for proposals. The US-based manufacturing institute reports that projects funded in 2016 and 2017 have made significant progress in building capacity to address a broad range of challenges, beginning with design and extending through processing, packaging, assembly and testing.
Headline themes for the next round include -
Electronic and Photonic Design Automation (EPDA)
A key focus is on lowering the cost, schedule and risk associated with creating new photonic integrated circuits (PICs) and systems
Multi-Project Wafer and Assembly (MPWA)
Sub-topics include integrating silicon photonics with CMOS logic and optimization of inline controls and test.
Test, Assembly, and Packaging (TAP)
Tooling at the AIM Photonics Rochester Hub TAP facility is expected to be operational by mid- to year-end 2018, to help support work in this area.
Very High Speed Datacom and Communications Links (VHS D&CL)
The goal is to develop transmission, interconnect, and switching operating at high data rates and with low power.
Analog and RF Applications
Examples include optical link technology and the co-design of optical/electrical systems for radio frequency photonics
Sensors
Integrated optical solutions for chemical, biological and physical measurement as well as the development of new components such as spectrometer on a chip designs.
Proposals are due Monday, June 19, 2017, by 9:00 AM EDT and further information, including details on a workshop for proposers, can be found by visiting - http://www.aimphotonics.com/2017-call-for-proposals/
Update from AIM Photonics CEO - Michael Liehr
