News Article

Kaiam To Acquire British III-V Facility

300,000 square foot Compound Photonics' fab will expand capacity for datacom transceivers, pHEMTs, HBTs, photodetectors, and lasers


Kaiam Corporation, a US maker of datacentre transceivers, intends to acquire the manufacturing facilities of Compound Photonics (CP) in Newton Aycliffe in the UK. The acquisition includes investment by CP into Kaiam to further develop the facility. The agreement is subject to final approvals, but is expected to close in the coming quarter.

This large manufacturing space enables expansion of Kaiam's datacom transceivers manufacturing capacity, and also includes an extensive cleanroom for processing of III-V devices, including pHEMTs, HBTs, photodetectors, and lasers.

Originally built as silicon fab for DRAMs, the plant was converted to III-V materials by subsequent acquirers and now has both a 3inch and 6inch line for III-V devices.

The addition of the Newton Aycliffe facility continues Kaiam's trajectory of vertical integration. Kaiam acquired Gemfire, its strategic PLC supplier, in 2013 and currently operates an 8inch silica-on-silicon line for the fabrication of integrated optical components in Gemfire's Livingston UK facility.


It also operates 40Gb/s and 100Gb/s optical packaging lines in that facility that are close to capacity due to increased demand. The new facility in Newton Aycliffe, with the fully operational wafer-fab, allows Kaiam to expand its silica-on-silicon and transceiver manufacturing, and provides a long term roadmap to add integrated InP photonic integrated circuits (PICs) for advanced transceivers.

“Our optical integration technology is based on MEMS-assisted assembly of different materials and components,” said Bardia Pezeshki, Kaiam's CEO. “We already have advanced integration in silica-on-silicon for manipulating light. In the future, with new modulation formats and increased speed, one also needs integration in the InP for generating, modulating, and detecting light.

“By using our unique hybrid integrated technology for combining silica-on-silicon PICs and InP PICs, we get the best of all worlds. The Newton Aycliffe site is a world-class facility in both capabilities and scale for producing III-V devices. This acquisition not only allows us to ramp product in the short term, but gives us access to advanced Integrated InP PICs at low cost that we will need in the long term.”

“CP no longer needed an in-house laser facility at Newton Aycliffe, and is very pleased that its Newton Aycliffe team are joining a fast-growing company in Kaiam,” added Brian Bolger, CFO at Compound Photonics. “As part of the transaction, CP is investing in Kaiam to become a significant shareholder, and looks forward to Kaiam's continued success.”

Lumentum to Exhibit at Five Tradeshows in Three Months
Tyndall to lead world's first photonics packaging pilot line
VPIphotonics and PhoeniX Software integrate solutions based on LioniX International TriPleX technology
Sherwin Cabatic joins Kaiam as Vice President of Sales
Kaiam to acquire British III-V Facility
TowerJazz Announces New Process for optical transceivers
UCSB researchers demonstrate chip-scale optical frequency synthesis
Imec demonstrates 896Gb/s photonics transceiver
Dutch researchers develop 1,000 times more efficient nano-LED
Infinera Introduces Instant Network product
PhoeniX and Synopsys to show PIC software at SPIE Photonics West
Qorvo Launches PAM4 Family for Datacentres
RETN Deploys Infinera Cloud Xpress in Europe
Lumentum Enhances 100G Long-Reach Datacom Portfolio
Infinera Reports Q4 and 2016 year Results
Lumentum to Exhibit at Four Tradeshows this quarter
Industry Group Forms Multi-Source Agreement for Shortwave WDM
Optical amplifier is smaller than a paper clip
ECIX uses Infinera Cloud Xpress to connect Datacentres
POET Reports $1.86 million in sales for 2016
German carrier boosts capacity with Infinera Cloud Xpress
Sherwin Cabatic joins Kaiam Corporation
Lumentum reports record revenue of $265 million
PhoeniX announces five day course on photonic chip design
Phoenix Announces new OptoDesigner Release
Emcore turns in a solid quarter
Emcore Announces products for Next Generation Networks
Fraunhofer Group and Leibniz Association to collaborate on future technology
NTT team advances photonics integration
The PIC movement is gaining momentum in the marketplace

Your firstname
Your lastname
Next »Close
Search the news archive

To close this popup you can press escape or click the close icon.
PIC Magazine




Not yet registered?

To close this popup you can press escape or click the close icon.